ECX-3200MX p/n EMB-VC-3200MX
Overview
Powered by 13th/12th Gen Intel® Core™ i9/i7/i5/i3 processor (Raptor Lake/Alder Lake) with Intel® R680E Chipset, Fanless, -40°C to 75°C operating temperature, 4 X-coded M12 2.5G PoE+ LAN, 6 USB 3.2, 1 USB Type-C supporting up to 20Gbps data rate, SIM sockets supporting 5G/WiFi/4G/3G/LTE/GPRS/UMTS mobile availability, 1 PCIe expansion for versatile configurations, smart manageability, 9V to 50V power input, software ignition power control, and trusted reliability, Vecow ECX-3200/3100 Series Workstation-grade Expandable Fanless Embedded System is your ideal choice for Machine Vision, Robot Waiter, Rolling Stock, Smart Retail, Vehicle Computing, AMR, and any AIoT/Industry 4.0 applications.
Features
Tech Specs
Features
FEatures and benefits
- Workstation-grade Platform : 13th/12th Gen Intel® Core™ i9/i7/i5/i3 Processor (Raptor Lake-S/Alder Lake-S) running with Intel® R680E PCH supports max 65W TDP CPU
- 2 DDR5 4800MHz Memory support up to 64GB
- 4 Independent X-coded M12 2.5GigE IEEE 802.3at PoE+ LAN, 2 GigE LAN
- PCIe x16 expansion supports up to 200W Power Budget
- Expansion : 1 PCIe, 2 M.2 Key B, 1 M.2 Key E, 1 Mini PCIe, optional SUMIT A, B
- 1 USB 3.2 Gen 2×2 Type C support up to 20Gbps data transfer
- DC 9V to 50V Power Input, Software Ignition Control
- 32 Isolated DIO, 4 COM RS-232/422/485
- Supports Intel® vPro, TCC, Time-Sensitive Networking (TSN), and TPM 2.0
- Optional VHub One-Stop AIoT Solution Service supports OpenVINO based AI accelerator and advanced Edge AI applications
- Fanless, -40°C to 75°C Operation Temperature
Tech Specs
System
| Processor | – 24-core 13th Gen Intel® Core™ i9/i7/i5/i3 Processor (Raptor Lake-S) – 16-core 12th Gen Intel® Core™ i9/i7/i5/i3 Processor (Alder Lake-S) |
| Chipset | Intel® R680E Chipset |
| BIOS | AMI |
| SIO | IT8786E |
| Memory | 2 DDR5 4800MHz SO-DIMM, up to 64GB |
I/O Interface
| Serial | 4 COM RS-232/422/485 |
| USB | – 6 USB 3.2 Gen 2, USB Type A Connector – 1 USB 3.2 Gen 2×2, USB Type-C Connector supports max 20Gbps data transfer (15W, 5V/3A) |
| Isolated DIO | 32 Isolated DIO : 16 DI, 16 DO |
| LED | Power, HDD, PoE, WLAN |
| SIM Card | 3 External Nano SIM Card Sockets |
| RTC Battery | 1 Front-access RTC Battery |
Expansion
| Mini PCIe | 1 Mini PCIe sockets for PCIe/USB/SIM Card |
| PCIe | 1 PCIe x16 slot |
| M.2 | – 1 M.2 Key B Socket (3042/2280, PCIe/USB 3, default/USB 2) – 1 M.2 Key B Socket (3052/2280, PCIe/USB 3, default/USB 2) – 1 M.2 Key E Socket (2230, PCIe/USB) |
| SUMIT | 2 SUMIT slots (Optional) |
Graphics
| Graphics Processor | Intel® UHD Graphics 770/730 driven by Intel® Xe Architecture |
| Interface | – 1 DVI-I : Up to 1920 x 1080 @60Hz – 1 HDMI : Up to 1920 ×1080 @60Hz – 2 DisplayPort : Up to 7680 x 4320 @60Hz/5120 x 2880 @60Hz |
Storage
| SATA | 2 SATA III (6Gbps) support S/W RAID 0, 1 |
| M.2 | 1 M.2 Key M Socket (2280, PCIe x4) |
| Storage Device | 2 Front-access 2.5″ SSD/HDD Tray |
Audio
| Audio Codec | Realtek ALC888S-VD, 7.1 Channel HD Audio |
| Audio Interface | 1 Mic-in, 1 Line-out |
Ethernet
| LAN 1 | Intel® I219LM GigE LAN supports iAMT |
| LAN 2 | Intel® I210 GigE LAN |
PoE (M12)
| LAN 3 | 2.5GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I226, X-Coded M12 Connector |
| LAN 4 | 2.5GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I226, X-Coded M12 Connector |
| LAN 5 | 2.5GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I226, X-Coded M12 Connector |
| LAN 6 | 2.5GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I226, X-Coded M12 Connector |
Power
| Power Input | DC 9V to 50V Power Input |
| Power Interface | 3-pin Terminal Block : V+, V-, Frame Ground |
| Ignition Control | 16-mode Software Ignition Control |
| Remote Switch | 3-pin Terminal Block |
Others
| TPM | Infineon SLB9670 supports TPM 2.0, SPI Interface |
| Watchdog Timer | Reset : 1 to 255 sec./min. per step |
| Smart Management | Wake on LAN, PXE supported |
| HW Monitor | Monitoring temperature, voltages. Auto throttling control when CPU overheats. |
Software Support
| OS | Windows 10, Linux |
Mechanical
| Dimension | 260mm x 240mm x 79mm (10.24″ x 9.45″ x 3.11″) |
| Weight | 4.5 kg (9.92 lb) |
| Mounting | – Wallmount by mounting bracket – VESA mount (Optional) – 2U Rackmount (Optional) |
Environment
| Operating Temperature | 35W TDP CPU : -40°C to 75°C (-40°F to 167°F), Fanless 65W TDP CPU : -40°C to 55°C (-40°F to 131°F), Fanless |
| Storage Temperature | -40°C to 85°C (-40°F to 185°F) |
| Humidity | 5% to 95% Humidity, non-condensing |
| Relative humidity | 95% at 75°C |
| Shock | – IEC 60068-2-27 – SSD : 50G @ wallmount, Half-sine, 11ms |
| Vibration | – IEC 60068-2-64 – SSD : 5Grms, 5Hz to 500Hz, 3 Axis |
| EMC | CE, FCC, EN50155, EN50121-3-2 |